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DS&HIVE

Poly Urethane 패드의 표면 눈막힘을 제거하여, 패드 Refresh를 해주는 Consumable

타켓
Semiconductor Chip-Maker (Non-memory, Memory (DRAM/FLASH), Foundries)
품 명
DS&HIVE
규 격
4.25" (Stainless Steel, Diamond-Nickel Bonding)
어플리케이션
반도체 CMP 공정(ILD, STI, Metal, Buffing, Barrier, Poly, Gate)
세 번
6804.21-0000
특장점
Stable Pad Roughness, Long conditioner life time, Long pad life time, Small debris size & Amount
031-000-0000